Mindspeed to Present Next Generation of 4G Base Station Technology at HOT CHIPS 22 Conference
Company Executive to Discuss Mindspeed’s Transcede Family of SoC Wireless Baseband Processors and Their Role in Today’s Major Industry Network Upgrade
NEWPORT BEACH, Calif.--(BUSINESS WIRE)-- Mindspeed Technologies, Inc. (NASDAQ:MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced that Chief Technology Officer James Johnston will present an in-depth architectural overview of the Transcede™ family of 3G/4G/long-term evolution (LTE) wireless baseband processors at the HOT CHIPS 22 conference at Stanford University in Palo Alto, Calif.
Johnston’s presentation, entitled “Transcede: Solving 4G Challenges for Pico, Micro and Macrocell Platforms,” will detail the system-on-chip (SoC) approach to overcoming the computational challenges and complexities presented by the explosion of video traffic across worldwide mobile networks, as today’s operators execute a massive infrastructure upgrade to new 4G standards. The presentation will take place during the SoC session on Monday, Aug. 23 at 1:45 pm PT. Other scheduled presentations during the SoC session will be “The New Xbox 360 SoC” from Rune Jensen of Microsoft Corporation and “Extensions to the ARMv7-A Architecture” from David Brash of ARM Ltd.
“The increasing use of smart phones and the surge of mobile video applications are key contributors to the network capacity crunch that many 3G subscribers are experiencing,” said Johnston. “3G and 4G network operators are looking to migrate to a more flexible cellular landscape, which can accommodate compact base stations, such as microcells, picocells and metro femtocells. Mindspeed has designed the Transcede family of baseband processors to enable tomorrow’s network architects to deploy powerful 4G macrocells and ‘small cells,’ which are built on a common framework.”
Launched earlier this year at the 2010 Mobile World Congress trade show in Barcelona, Spain, the Transcede family of SoCs integrates an unprecedented 26 programmable processors into a single device, including two ARM® Cortex A9® multi-core symmetric multiprocessing (SMP) reduced instruction set computer (RISC) processors, ten CEVA® digital signal processors (DSPs) and ten DSP accelerators that support the complete wideband code-division multiple access (W-CDMA), LTE or WiMAX (Layers 1, 2 and above) processing needs of single- and multi-sector base stations. The Transcede family of SoCs can deliver three sectors of LTE processing in a single device, while still providing substantial processing headroom, allowing manufacturers to deploy their own value-added features as part of an overall Transcede-based solution.
The Transcede family of wireless baseband processors are designed to:
- be software configurable for all flavors of LTE, W-CDMA and WiMAX;
- support wireless standards in China, including TD-SCDMA and TD-LTE;
- significantly reduce system bill of materials (BOM);
- provide the lowest possible latency;
- enable a simplified programming model allowing easy adaptation;
- offer a comprehensive roadmap of scalable SoCs across a wide range of base stations; and
- optimize power efficiency in wireless handset applications and reduce power; consumption during low-traffic periods.
About HOT CHIPS
Since it started in 1989, HOT CHIPS has been known as one of the semiconductor industry's leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in August on the Stanford University campus in the center of the world's capital of electronics activity, Silicon Valley. It provides an opportunity for chip designers, computer architects, system engineers, press and analysts, as well as attendees from national laboratories and academia to mix, mingle and see presentations on the latest technologies and products. The three days of the conference typically feature two tutorials, two keynotes, a panel discussion and around 25 presentations on a variety of subjects related to microprocessors and integrated circuits. HOT CHIPS 22 is sponsored by the IEEE Technical Committee on Microprocessors and Microcomputers. The event’s technical affiliates include the IEEE Solid-State Circuits Society and the IEEE Computer Society.
About Mindspeed Technologies
Mindspeed Technologies, Inc. designs, develops and sells semiconductor solutions for communications applications in the wireline and wireless network infrastructure, which includes today's separate but interrelated and converging enterprise, broadband access, metropolitan and wide area networks. Our products are classified into three focused product families: communications convergence processing, high-performance analog and wide area networking communications. Our products are sold to original equipment manufacturers (OEMs) for use in a variety of network infrastructure equipment, including voice and media gateways, high-speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers, digital loop carrier equipment, IP private branch exchanges (PBXs), optical modules, broadcast video systems and wireless base station equipment.
To learn more, visit us at www.mindspeed.com.
Safe Harbor Statement
This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Such statements include statements regarding the company's expectations, goals or intentions, including, but not limited to, product features and their benefits. These forward-looking statements are based on management's current expectations, estimates, forecasts and projections about the company and are subject to risks and uncertainties that could cause actual results and events to differ materially from those stated in the forward-looking statements. These risks and uncertainties include, but are not limited to: fluctuations in our operating results and future operating losses; worldwide political and economic uncertainties and specific conditions in the markets we address; constraints in the supply of wafers and other product components from our third-party manufacturers; fluctuations in the price of our common stock; cash requirements and terms and availability of financing; loss of or diminished demand from one or more key customers or distributors; our ability to attract and retain qualified personnel; doing business internationally and our ability to successfully and cost effectively establish and manage operations in foreign jurisdictions; pricing pressures and other competitive factors; successful development and introduction of new products; lengthy sales cycles; order and shipment uncertainty; our ability to obtain design wins and develop revenues from them; the expense of and our ability to defend our intellectual property against infringement claims by others; product defects and bugs; business acquisitions and investments; and our ability to utilize our net operating loss carryforwards and certain other tax attributes. Risks and uncertainties that could cause the company's actual results to differ from those set forth in any forward-looking statement are discussed in more detail under "Risk Factors" and "Management's Discussion and Analysis of Financial Condition and Results of Operations" in the company's Quarterly Report on Form 10-Q for the quarter ended July 2, 2010, as well as similar disclosures in the company's subsequent SEC filings. Forward-looking statements contained in this press release are made only as of the date hereof, and the company undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.
CONTACT:
Editorial Contact:
Magnet PR Group
Lisa Briggs, 949-305-5131
lisab@magnetprgroup.com
or
Investor Relations Contact:
Mindspeed Technologies, Inc.
Andrea D. Williams, 949-579-3111
KEYWORDS: United States North America California
INDUSTRY KEYWORDS: Technology Electronic Design Automation Internet Networks Telecommunications Semiconductor Mobile/Wireless
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