On the eve of Major League Baseball's All-Star game July 16 at Citi Field in New York City, Anand Chandrasekher, senior vice president and CMO of Qualcomm, talked with Editor Tammy Parker about his company's work with the MLB to address connectivity issues in U.S. ballparks. See this On the Hot Seat interview.
In April, Qualcomm announced that network engineers from wholly owned subsidiary Qualcomm Technologies Inc. (QTI) are working directly with Major League Baseball's MLB Advanced Media (MLBAM) unit to address connectivity challenges in U.S. ballparks. FierceBroadbandWireless Editor Tammy Parker spoke with Anand Chandrasekher, senior vice president and CMO of Qualcomm, about the company's major league ballpark initiative.
The past few months have seen a number of announcements from mobile operators and neutral-host providers that have deployed DAS and Wi-Fi networks in a variety of sports venues worldwide. Of course, the need for improved connectivity in such locations is no secret to any fan who has tried unsuccessfully to text or call someone or surf the Web from their mobile device while attending a live sporting event.
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AT&T claims it cannot deploy LTE over its 700 MHz Lower D and E Block spectrum until mid to late 2014 because the necessary interoperability test cases for LTE Advanced carrier aggregation are still in development within 3GPP.
Ever a mobile market pacesetter, SK Telecom has rolled out the world's first LTE-Advanced network with a commercial smartphone ready for use with the service.
Any parent will tell you: It's not easy to get kids to share. The same, it seems, is true in wireless. There's a debate brewing over how to free up 100 MHz in the 3.5 GHz band for small cells, and the resolution could have significant implications on future spectrum regulations.
The battle among different consortia in the market for wireless charging is heating up, with chipset heavyweight Intel backing relative newcomer Alliance for Wireless Power (A4WP). Intel will become a board member of A4WMP, alongside Broadcom, Gill Industries, Integrated Device Technology (IDT), Qualcomm, Samsung Electronics and Samsung Electro-Mechanics.
Intel showed off its next-generation Atom-based chipset for smartphones, but an Intel executive lamented the fact that the company's mobile chipsets are not yet getting traction because they lack support for LTE.
Qualcomm this week removed the wraps from its FSM99xx family of 28 nanometer chips that integrate 3G and LTE for use in small cells.