Japan's NTT DoCoMo says it has successfully trialed low-powered LSI chips that could power next-gen handsets.
In testing, the LSI achieved a transmission rate of 200Mbps with high precision over a high-speed wireless network, while power consumption did not exceed 0.1W, the Japanese carrier said.
The chip contained would be able to work at low-power consumption and also be small enough to fit into handsets for what DoCoMo has dubbed 'Super 3G'.
Super 3G, which is called Long Term Evolution in the 3GPP, will provide downlinks in excess of 100Mbps.