Nokia and German chipmaker Infineon have partnered to develop new LTE RF products.
The non-exclusive agreement will see the companies co-developing modem solutions for HSPA through to LTE, using Nokia's baseband modem and Infineon's RF technologies.
Infineon is already one of Nokia’s 3G chip suppliers. Both companies say they will ensure current and future baseband and RF technologies are interoperable.
“This cooperation will help to deliver standard-based, industry leading solutions for mobile internet devices,” said Nokia’s vice-president of wireless modems, Pekka Sarlund.
Under the collaboration, the two firms will aim for a standard LTE-Advanced interface, enabling data rates of up to 1Gbps and a fast rollout of new products, the statement said.