Infineon reveals new 3G platform

Chipmaker Infineon announced its new generation 3G platform family is ready. The platform is designed to reduce the number of devices in the chipset from three to two and the component count by about 50 percent. Infineon says the new 3G solutions sport the industry's smallest printed circuit board (PCB) footprint, allowing for space reduction of up to 40 percent. And power standby is reduced by up to 30 percent compared with existing HSDPA platform solutions, said Infineon.

"Our new platforms enable our customers to fully reuse their hardware and software developments and launch multiple phones covering all feature phone market segments with lower cost and faster time-to-market," said Prof. Dr. Hermann Eul, executive vice president of the Infineon Management Board and president of the Communication Solutions Business Group.

The platform offers HSDPA/HSUPA capabilities of 7.2Mbps uplink and 2.9 Mbps downline, an integrated high-end video accelerator for recording and playback of VGA video content and the ability to connect to cameras with up to 5 megapixels.

Earlier this week, Infineon warned that it anticipates a larger operating loss and flat sales for its communication chips unit this quarter. Infineon cited delays in shipping a single chip solution for Nokia's ultra low-end phones. Just last month Infineon had said the deal was on track. Infineon shares fell 7.8 percent on the news. Infineon is also rumored to be supplying the new 3G iPhone's HSDPA chipset.

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Related stories:
Chipmaker Infineon warns of larger loss this quarter. Infineon story
Rumor du jour: HSDPA iPhone coming in June. HSDPA iPhone story

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