Qualcomm said device vendors have begun sampling dual-carrier HSPA+ chips and multi-mode 3G/LTE chips.
Qualcomm said its MDM8220solution is the first chipset to support dual-carrier HSPA+, and the MDM9200 and the MDM9600chipsets are the industry's first multi-mode 3G/LTE solutions. The chip maker said it expects commercial launches of devices based on Qualcomm's MDM solutions to begin during the second half of 2010.
"These chipsets demonstrate significant progress toward enabling the mass-market commercial deployment of two next-generation network technologies that bring more advanced data capabilities to mobile devices for new global markets in addition to North America," the company said.
Qualcomm said it is working with numerous network operators, infrastructure vendors and device manufacturers with its dual-carrier HSPA+ and/or LTE solutions. Among multiple network operators evaluating the new technologies are Japan's Emobile and Telstra Wireless. Qualcomm is also working with multiple infrastructure vendors, such as Huawei Technologies and Nokia Siemens Networks, to perform interoperability tests for dual-carrier HSPA+ and LTE. Among the many device manufacturers currently evaluating the new chipsets are Huawei, LG Electronics, Novatel Wireless, Sierra Wireless and ZTE.
In addition, AT&T Mobility will launch the first smartbook, a new device that Qualcomm has been pushing that will combine the always-on connection smartphones have with the larger display of a netbook. The device will be made by Lenovo and will run on Qualcomm's Snapdragon chipset.
Qualcomm announced the device at its investor meeting in New York last week, however the company did not provide any more details, including its price and availability, since the smartbook will be officially announced at the Consumer Electronics Show next year. The announcement also is another indication that AT&T is looking to expand beyond mobile phones, as it has already established itself as a strong supporter of wireless ereaders.
- see this release
- read this FierceWireless article
Timescales for LTE devices on the slide
Qualcomm outlines plans for multimode 3G/LTE chipset
Qualcomm reveals LTE chip plans