Nokia to co-op on LTE-Advanced chipset

Looking to set the interface standard for 1Gbit/s LTE-Advanced data rates has seen Nokia announce a R&D partnership with Infineon Technologies to ensure its baseband modem technologies work with Infineon's RF chipsets.

According to Nokia, engineers from the two firms would cooperate on the development of RF transceivers for use in LTE products that could lead to systems delivering 1Gbit/s data transfer rates. The project will involve R&D teams working on the architectural and system issues with the compatibility verified by way of a technology reference platform. Striking a note of caution, Infineon would not commit to when the 1Gbit/s wireless data rate would be achieved or when the Infineon-Nokia verification platform would be demonstrated.

However, Nokia indicated that the joint work would incorporate an open interface to enable a fast roll out of HSPA and LTE networks, and the company confirmed it would be prepared to licence the new baseband modem design.

Prof. Hermann Eul, of the Infineon management board, said, "Pairing Nokia's advanced modem technology and Infineon's best in class RF transceiver solutions, would give the industry access to very competitive chipset solutions."

For more on this story:
EE Times

Related stories:
LTE Advanced: EU to invest 18m euros to capture lead in next-gen wireless standard
3GPP urges caution over IMT-Advanced promises
Timescales for LTE devices on the slide
TeliaSonera secures LTE modems for 2010 launch

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