LG Electronics joins the OPNFV Project; ESTI group releases spec for embedded M2M modules

Wireless tech news from across the web:

> Verizon may be taking its SDN strategy to the next level with a major push toward the deployment of bare-metal switches in next-generation networking architecture. Article

> ZTE Corporation has joined the OPNFV Project as a Platinum member. ZTE joins the other Platinum members including AT&T, Brocade, China Mobile, Cisco, Dell, Ericsson, HP, Huawei, IBM, Intel, Juniper Networks, NEC, Nokia Networks, NTT DOCOMO, Red Hat, Telecom Italia and Vodafone. Release

> Xilinx and NXP announced their collaboration to reduce capex and opex costs of wireless infrastructure radios. Release

> ETSI's Industry Specification Group for Surface Mount Technique has released its group specification for embedded communication modules for machine to machine communications. Release

> Extreme Networks expanded its relationship with the National Football League to become the first Official Wi-Fi Solutions Provider for the league. Release

> LG Uplus and Nokia Networks trialed the Intelligent Network Platform in a live LTE network. Release

> A Canadian man who racked up a $1,171 Wi-Fi bill on a Singapore Airlines flight will have to pony up the full amount. Story

> LG Electronics is the latest company to join the AT&T Drive Studio, AT&T's connected car center in Atlanta.  Article

> Former BlackBerry CEO Thorsten Heins is now heading wireless charging startup Powermat Technologies. Article

And finally… A sheep farmer in South Africa stumbled across what appears to be a crashed balloon from Google's Project Loon. Story

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